Senior Equipment Engineer (Wire Bond)

Role Summary

Responsible for driving wire bonding equipment performance and reliability to meet production targets. The role focuses on improving Overall Equipment Effectiveness (OEE), and minimizing unplanned downtime (UDT). This includes planning maintenance strategies, leading troubleshooting activities, and collaborating cross-functionally to ensure stable and efficient equipment operation.

At Renesas, you can

Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.

Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.

Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?

Join Renesas. Let’s Shape the Future together.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .

Responsibilities

• Drive and improve equipment performance metrics (OEE, MTBC, UDT)
• Lead troubleshooting and root cause analysis for equipment-related issues
• Plan and optimize preventive maintenance strategies and schedules
• Monitor equipment performance trends and drive improvement initiatives
• Collaborate with production, process, and vendors to implement effective solutions
• Coach and guide technicians on technical problem-solving and best practices

Requirements

• Bachelor’s Degree in Engineering (Mechanical / Electrical / Mechatronics / Manufacturing)
• Minimum 6 years’ experience in semiconductor equipment maintenance (wire bond preferred)
• Strong troubleshooting and root cause analysis capability
• Solid understanding of equipment performance metrics (OEE, MTBC, downtime analysis)
• Good leadership and cross-functional communication skills

Good to have

• Experience with wire bonding equipment (E.g. Shinkawa UTCx000 series, K&S Iconn)
• Familiar with structured problem-solving methodologies
• Experience in equipment reliability and optimization projects
• Hands-on experience in equipment troubleshooting and validation
• Ability to prepare clear, structured, and comprehensive technical reports
• Knowledge in automation, vision systems, and predictive maintenance approaches

Benefits

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.

With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’