HPC High-Speed I/F Engineering Manager

Role Summary

[Recruitment background]

As automobiles become increasingly electrified and intelligent, in-vehicle SoCs have become a core technology that determines the value of cars.

The R-Car series has continued to evolve as a large-scale, highly functional automotive SoC that highly integrates numerous SoC IPs, including CPU, high-speed interface, memory, AI/video, functional safety, and security.

In order to continuously promote the development of next-generation automotive SoCs, our division is strengthening our SoC IP development system, including the selection and integration of IP to be introduced, in addition to in-house IP development.

In particular, in core areas such as high-speed interface subsystems, the importance of human resources who can handle both technical judgment and organizational management is increasing as development scale and technical difficulty increase.

The purpose of this recruitment is to recruit people who can lead development from both a technical and organizational perspective, with a focus on high-speed interface subsystem development, and who can contribute to strengthening the development system for the future.

[Business content]

As a section manager who oversees the design and development of the entire high-speed interface subsystem for in-vehicle SoCs (R-Car series), he is responsible for both organizational management and technical decisions, and leads development.

Develop specification and architecture policies for high-speed interface subsystems including PCIe, UCIe, USB, and UFS, and ensure quality through design reviews and technical judgments.

Perform priority judgment and final decision-making as a subsystem based on performance, power consumption, quality, schedule, and resource constraints.

Collaborate with SoC architects, other subsystem managers, and project management to promote overall SoC optimization while making cross-departmental adjustments.

As the person in charge, lead the resolution of important technical and organizational issues that arise during the design and verification phases.

Responsible for technical negotiations, specification adjustments, and problem solving with IP vendors regarding introduced IP.

Manages a global development team consisting of design bases in Japan, India, and Vietnam, and promotes role design, human resource development, and system strengthening.

*Details regarding the scope of changes to the workplace and the scope of changes to the duties to be engaged in will be provided at the time of selection.

Requirements

• [MUST]
• Technical lead experience at subsystem or IP level
• (Leading design review, technical judgment, design policy formulation, etc.)
• Experience collaborating with multiple engineers and related teams to coordinate technology and development.
• Comfortable with technical discussions and coordination in English, or working with a global team.
• Japanese: Business level
• [WANT]
• Section Manager or equivalent people management experience
• Experience in managing multiple members/multiple locations (including overseas) in SoC development
• Experience in proactively participating in organizational management, such as resource planning, personnel assignment, and training planning.
• Experience of involvement in technology roadmap and system review from a medium- to long-term perspective
• Experience involved in technical communications with external IP vendors and partners.
• (Confirm specifications, organize constraints, address issues, etc.)
• Practical experience in specification review, design, and verification of high-speed interfaces including PCIe, UCIe, USB, and UFS
• Experience in developing automotive SoCs or products with high functional safety and quality requirements
• Knowledge of power separation design and physical design (P&R)

Benefits

Renesas is a global company that provides embedded semiconductor solutions with a purpose of "To Make Our Lives Easier." Together with over 21,000 engineers and problem-solving professionals working in more than 30 countries around the world, we are involved in the development of the world's most cutting-edge technologies in the automotive, industrial, infrastructure, and IoT fields, contributing to the realization of a safer, healthier, greener, and smarter future.

At Renesas, "TAGIE (Transparent, Agile, Global, Innovative, Entrepreneurial)" is the core of our corporate culture. TAGIE is a set of shared values that underpins the way we work, the way we grow, and our efforts to realize our Purpose. This collaborative spirit and challenging mindset enable us to transform industries and contribute to the lives of people around the world through semiconductor technology.

• We offer a competitive compensation plan, as well as a comprehensive benefits package. We will provide details about benefits during the selection process.
• Why not join us in the challenge of creating the future together? We look forward to receiving your applications.