Electromechanical Engineer

Role Summary

• Electromechanical Engineer Bedford, MA $97,000 ‒ $149,000 Annually Photonics Electromechanical Engineer
• Department: Photonics Division
• Location: Bedford, MA (On-site)
• Reports To: Engineering Manager
• Employment Type: Full-time
• QCi is seeking an Electromechanical Engineer to develop and integrate advanced electro-optic (EO), opto-
• electronic (OE), RF, and photonic (SiPh/PIC) modules. This role focuses on electromechanical integration,
• ensuring that electrical structures, interconnects, thermal systems, and mechanical packaging are

combined into reliable, manufacturable products.

• The successful candidate will work across the full product lifecycle—from concept development and CAD
• design through prototyping, characterization, qualification, and manufacturing transfer. This is a highly
• hands-on role for an engineer who enjoys solving multidisciplinary engineering challenges and working

closely with product development and manufacturing teams.

Responsibilities

Electromechanical Integration & Design

Own the electromechanical integration and packaging of EO, OE, photonic, and RF modules, including electrical structures, interconnects, thermal systems, packaging, and enclosure design. Design and integrate transmission lines, interposers, PCBs, connectors, flex circuits, wire/ribbon bonds, and related interconnect technologies. Co-design electrical layouts and mechanical housings to ensure proper fit, alignment, thermal performance, manufacturability, reliability, and signal integrity. Specify and integrate TECs, thermistors, drivers, and control electronics while supporting power budgeting and thermal management. Design fixtures, tooling, and support hardware for assembly, testing, and qualification activities. Testing & Characterization

Develop and execute electrical test plans, including continuity, functional, and S-parameter characterization. Develop data acquisition, automation, and analysis tools using Python or similar scripting languages. Build and qualify test fixtures, jigs, and automated measurement systems. Support hardware troubleshooting, root-cause investigations, and corrective actions. Manufacturing & Productization

Build and maintain component libraries using distributor data from Digi-Key, Mouser, and other approved suppliers. Author assembly procedures, work instructions, and engineering documentation. Collaborate with manufacturing and suppliers to improve yield, reliability, cost, and manufacturability Support qualification efforts to standards such as MIL-STD-883, Telcordia GR-468, and related reliability requirements. Drive successful transfer of designs from prototype development into manufacturing, including process documentation, design-for-manufacturing (DFM), yield improvement, and production support. Required Qualifications

• B.S. in Electrical Engineering, Mechanical Engineering, Electromechanical Engineering, or a related

engineering discipline.

• 2+ years of relevant industry experience in electromechanical product development.
• Experience integrating PCBs, interconnects, packaging, and mechanical structures into

manufacturable hardware.

• Experience with PCB design and layout using industry-standard EDA tools such as Altium Designer,

KiCad, OrCAD, or equivalent.

• Proficiency with SolidWorks or equivalent 3D CAD software.
• Proficiency in Python or similar tools for automation, data analysis, and process control.
• Experience creating and maintaining component libraries, including footprints, symbols, sourcing

information, and lifecycle management.

• Hands-on laboratory experience with hardware assembly, troubleshooting, testing, and

characterization.

• Demonstrated ability to solve multidisciplinary engineering problems involving electrical, mechanical,

thermal, and manufacturing constraints.

Requirements

Preferred Qualifications

• Experience with RF and microwave characterization, measurement, and high-frequency interconnect

design.

• Familiarity with controlled-impedance design, S-parameters, VNA measurements, and signal-integrity

considerations.

• Familiarity with HFSS, CST, or similar electromagnetic simulation tools
• Experience packaging EO, OE, RF, or photonic modules, including die attach, wire/ribbon bonding,

hermetic sealing, laser welding, or fiber attachment.

• Experience with qualification testing and reliability standards.
• Experience with aerospace, defense, telecommunications, or other high-reliability industries.

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